Built for customers and partners developing high-density AI infrastructure, compact sensing systems, and package-scale optical data movement.
Silicon photonics, low-loss optical coupling, and package-aware design help bring high-density optical links closer to compute.
Our engineering team combines photonic IC design, packaging, testing, and system integration experience.
Stable funding support enables long-horizon photonic product development, prototype validation, and industrial scale-up.
We work with customers, partners, and suppliers to align photonic technology with practical system deployment needs.
Each path is designed around practical system integration: package-aware photonics, stable alignment, and validation support for prototypes and early product directions.
A compact photonic engine concept for short-reach, high-bandwidth xPU interconnect and package-aware optical coupling.
A silicon photonic sensing platform for compact optical measurement systems and application-specific optical paths.
Packaging workflows for customers developing photonic chips, modules, evaluation systems, and early-stage validation plans.
